MOSCOW (MRC) -- At the European Coatings Show (ECS) in Nuremberg, Germany, from April 21 to 23, 2015, the Munich-based Wacker Group will be exhibiting a new polymeric binder for modifying gypsum drywall products, reported the company on its site.
VINNAPAS 4800 G is a new polymer powder ideal for enhancing ecologically sound, gypsum-based joint fillers and jointing compounds for drywall applications. Gypsum mortars containing the powder yield smooth, crack-free surfaces, are easy to apply and offer excellent adhesion.
VINNAPAS 4800 G dispersible polymer powder is based on vinyl acetate and ethylene and was specially developed for enhancing gypsum-based joint-filler compounds. The new powder boosts the adhesion of grout mortars to both reinforcement strips and plasterboard. The reinforcement strips, which may be made of paper, glass fiber, or specialty nonwovens, are placed in the joints and plastered over to make the joint more stable and to prevent cracks.
Thus, VINNAPAS 4800 G gives gypsum-based joint fillers outstanding tensile adhesive strength on gypsum plasterboard and jointing tapes. Joint fillers finished with this new dispersible polymer powder also show excellent workability to yield particularly smooth surfaces. Furthermore, the powder’s low emissions make it ideal for joint fillers and jointing compounds used indoors.
Plus, Wacker will be presenting SILRES BS POWDER S, an additive for waterproofing gypsum-based dry-mix mortars. This highly efficient powder is low in volatile organic compounds and can be quickly mixed with water without raising dust.
SILRES BS POWDER S consists of a methyl siliconate which is produced as a colorless, free-flowing powder by a special process. The active ingredient is inherently soluble in water, a property which confers excellent mixing properties when the mortar is being prepared. Nonetheless, the gypsum mortar is water-repellent as soon as it sets.
SILRES BS POWDER S can be used with all types of gypsum dry mix mortars, irrespective of the pH. It eliminates the prereaction times which are often needed by conventional powder-form water-repellent agents. The additive even supports the formulation of Type H1 gypsum jointing compounds that meet the highest requirements for reduced water absorption. According to Standard EN 13963:2014, which was revised last year, Type H1 joint fillers must absorb no more than 5 weight percent water after setting.
As MRC wrote before, in November 2014, Wacker developed a thermally conductive adhesive for electronics applications. The new silicone rubber with the trade name SEMICOSIL 975 TC is characterized by high thermal conductivity and good flow and processing properties. Even light pressure is enough to form an ultrathin adhesive layer between the contact surfaces. This ensures not only good bonding, but also optimum heat dissipation by the heat sink. SEMICOSIL 975 TC is an ideal interface material for forming thermal and mechanical connections in power electronics components or packages.
Wacker Chemie AG is a worldwide operating company in the chemical business, founded 1914. The company is controlled by the Wacker-family holding more than 50% of the shares. The corporation is operating more than 25 production sites in Europe, Asia, and the Americas. The product range includes silicone rubbers, polymer products like ethylene vinyl acetate redispersible polymer powder, chemical materials, polysilicon and wafers for semiconductor industry.
MRC